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    • Hot：
    K4A4G165WF-BCTD SSDPEKNU512GZ MT40A512M16LY-075:E
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    Brand:
    Samsung Micron Hynix Winbond nanya ELPIDA Etron ISSI ProMOS Alliance Memory Zentel
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    Memory format:
    DRAM -
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    Installation type:
    - Surface mount
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    packing:
    TR,-,- pallet CT bulk TR box TR,CT pipe
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    Part status:
    On sale Final sale stop production Not applicable to new design
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    Memory type:
    Volatile
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    storage capacity :
    512Mb 4 Gb 1 Gb 1Gb 2Gb 4Gb 16Gb 2 Gb 16 Gbit 512 Mbit 2 Gbit 1 Gbit 4 Gbit 8 Gbit 512Mb(32M x 16) 1Gb(64M x 16) 1Gb(128M x 8) 1Gb(256M x 4) 2Gb(128M x 16) 2Gb(256M x 8) 2Gb(512M x 4) 4Gb(512M x 8) 4Gb(1G x 4) 8Gb(512M x 16) 8Gb(2G x 4) 16Gb(1G x 16) 4Gb(256M x 16) 8Gb(1G x 8) 2GB 4GB 8GB
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    Voltage - Supply:
    1.283V ~ 1.45V,1.425V ~ 1.575V 1.35 V 1.35V 1.5V 1.2V - 1.283V ~ 1.45V 1.425V ~ 1.575V
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    working temperature :
    0 ~ 85 °C -40 ~ 95 °C -40°C ~ 115°C(TC) -40 ~ 105 °C -40°C ~ 95°C(TC) -40°C ~ 105°C(TC) 0°C ~ 95°C(TA) -40°C ~ 85°C(TC) -25°C ~ 85°C(TC) 0°C ~ 95°C(TC) -40°C ~ 125°C(TC) 0°C ~ 85°C(TC)
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    Encapsulation/Housing:
    FBGA 96-VFBGA 78-VFBGA 96-LFBGA 96TBGA 9FBGA 78FBGA 96FBGA BGA-96 FPGA-96 FPGA-78 WFBGA-200 SMD PBGA96 BGA96 FBGA96 FBGA78 BGA-78 TFBGA-78 BGA 96-TWBGA(10x14) 96-TWBGA(9x13) FBGA-96 FBGA-78 FBGA82 96-TFBGA 96-FBGA 78-TFBGA 82-FBGA
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    choosed:
  • -40°C ~ 105°C(TC)
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  • DRAM
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  • On sale
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  • Winbond
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    • Total：24
    Photo
    Mfr.Part #
    Brand
    Description
    DataSheet
    Pricing(USD)
    Qty
    W631GG6NB11J TR
    W631GG6NB11J TR
    Winbond
    IC SDRAM 1GB X16 933MHZ 96WBGA
    Datasheet
    Call
    Offer
    W631GG8NB15J TR
    W631GG8NB15J TR
    Winbond
    IC SDRAM 1GB X8 667MHZ 78WBGA
    Datasheet
    Call
    Offer
    W631GG8NB09J TR
    W631GG8NB09J TR
    Winbond
    IC SDRAM 1GB X8 1066MHZ 78WBGA
    Datasheet
    Call
    Offer
    W631GG8NB11J TR
    W631GG8NB11J TR
    Winbond
    IC SDRAM 1GB X8 933MHZ 78WBGA
    Datasheet
    Call
    Offer
    X
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