BUF634FKTTTE3
The pictures are for reference only
likeBUF634FKTTTE3
Brand：TI
Model：BUF634FKTTTE3
stock：16720
Store：ShenZhen/Hongkong
DataSheet：
DataSheet
DataSheet
Price：1+
￥29.77
The market price fluctuates. Please consult the customer service for the actual price
Similar Product
product details
Common problem
Industry trends
| Installation type | Surface mount |
| packing | TR,CT |
| series | - |
| Part status | Not applicable to new design |
| working temperature | -40°C ~ 85°C |
| Encapsulation/Housing | TO-263-6,D²Pak(5 feedthrough),TO-263BA |
| Country of origin | USA |
| Warehouse | China/Hong Kong |
| quality | Original genuine |
| type of output | - |
| Current Output/Channel | 250 mA |
| Amplifier type | buffer device |
| Number of circuits | 1 |
| Pendulum rate | 2000V/µs |
| Gain bandwidth product | - |
| -3db bandwidth | 180 MHz |
| Current input bias | 5 µA |
| Voltage input compensation | 30 mV |
| Current supply | 15mA |
| Voltage span (minimum) | 4.5 V |
| Voltage span (maximum) | 36 V |
Common problem
Industry trends
M391A4G43AB1-CVF Samsung DDR4 2933 ECC 32GB server memory module
M393A2K43CB2-CVF Samsung 2933 DDR4 16G server memory slot
M393A2K40EB3-CWE Samsung DDR4 3200 16GB server memory module
Real hammer! The iPhone 14 National Bank version uses domestic flash memory, why doesn't Apple admit it?
M391A2K43DB1-CVF Samsung DDR4 2933 ECC 16G server memory module
M391A4G43AB1-CWE Samsung DDR4 3200 ECC 32GB server module
Memory chip manufacturers collectively "winter"
M393A4K40EB3-CWE Samsung DDR4 3200 RECC 32G server memory module
Advantages of Micron memory chips (why micron chips are recommended)
Trelleborg will showcase its latest semiconductor Subfab solution at SEMICON Taiwan 2022
Hot Products
Product recommendation
Offer
