ULN2003AN
The pictures are for reference only
likeULN2003AN
Brand：TI
Model：ULN2003AN
stock：10351
Store：ShenZhen/Hongkong
DataSheet：
DataSheet
DataSheet
Price：1+
￥1.11
The market price fluctuates. Please consult the customer service for the actual price
Similar Product
product details
Common problem
Industry trends
| Installation type | Through-Hole |
| packing | bulk,pipe |
| Part status | On sale |
| Voltage - Supply | unwanted |
| working temperature | -40°C ~ 70°C(TA) |
| Memory interface | Paralleling |
| Encapsulation/Housing | 16-PDIP |
| Warehouse | China/Hong Kong |
| quality | Original genuine |
| type of output | NPN |
| characteristic | - |
| Number of outputs | 7 |
| Fault protection | - |
| Output Configuration | low side |
| Current - Output | 500mA |
| Ratio - Input: Output | 1：1 |
| Input Type | Anticorrelation |
| switch type | relay device,solenoid Driver |
| Voltage load | 50V(max) |
| On resistance (typical value) | - |
Common problem
Industry trends
Texas Instruments' new Texas chip factory began mass production
Advantages of Micron memory chips (why micron chips are recommended)
M393A4G43AB3-CVF Samsung DDR4 2933 RDIMM 32G server memory
M474A4G43MB1-CTD Samsung 32G DDR4 2666 ECC workstation memory
MTA36ASF4G72PZ-3G2R1 MG DDR4 3200 2Rx4RDIMM 32GB server memory module
HMA82GR7DJR8N-XN Hynix DDR4 3200 16G RDIMM server memory
M393A2K40DB2-CVF Samsung DDR4 2933 16G server memory
M393A2K40DB3-CWE Samsung 16G DDR4 3200 RECC server memory module
Real hammer! The iPhone 14 National Bank version uses domestic flash memory, why doesn't Apple admit it?
HMA84GR7DJR4N-XN Hynix DDR4 3200 32G server memory module
Hot Products
Product recommendation
Offer
