TJF1052IT/1Y
The pictures are for reference only
likeTJF1052IT/1Y
Brand：NXP
Model：TJF1052IT/1Y
stock：2394
Store：ShenZhen/Hongkong
DataSheet：
DataSheet
DataSheet
Price:
The market price fluctuates. Please consult the customer service for the actual price
Similar Product
product details
Common problem
Industry trends
| Installation type | Surface mount |
| packing | TR |
| series | - |
| Part status | stop production |
| Voltage - Supply | 3V ~ 5.25V |
| type | CAN |
| working temperature | -40°C ~ 105°C |
| Encapsulation/Housing | 16-SOIC(0.295,7.50mm wide) |
| Warehouse | China/Hong Kong |
| quality | Original genuine |
| technology | Capacitive coupling |
| Voltage - Isolation | 1000Vrms |
| Data rate | 2Mbps |
| Channel type | one direction |
| Rise/fall time (typical value) | - |
| Isolated power supply | No |
| Number of channels | 2 |
| Input - Side 1/Side 2 | 1/1 |
| Common mode transient immunity (minimum) | 20kV/µs |
| Propagation delay tpLH/tpHL (maximum) | - |
| Pulse width distortion (maximum) | - |
Common problem
Industry trends
Advantages of Micron memory chips (why micron chips are recommended)
Texas Instruments' new Texas chip factory began mass production
M393A4K40EB3-CWE Samsung DDR4 3200 RECC 32G server memory module
SEMICON Taiwan 2022 focuses on advanced manufacturing, heterogeneous integration, sustainability and talent
M393A2K40EB3-CWE Samsung DDR4 3200 16GB server memory module
Applications of Intel Xeon Platinum 8468
Samsung M391A2K43DB1-CWE DDR4 16G 2933 memory memory IC chip
M393A2K43DB2-CVF Samsung DDR4 2933 RECC 16G Server Memory Module
SK Hynix successfully developed 238 layers of NAND flash memory
Trelleborg will showcase its latest semiconductor Subfab solution at SEMICON Taiwan 2022
Hot Products
Offer
