Total: 164
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
TR,CT
1Gb(64M x 16)
1Gb(128M x 8)
2Gb(128M x 16)
2Gb(256M x 8)
4Gb(512M x 8)
1Gb(128M x 8)(NAND),512M(32M x 16)(LPDDR2)
2Gb(256M x 8)(NAND),1G(32M x 32)(LPDDR2)
2Gb(256M x 8)(NAND),2G(64M x 32)(LPDDR2)
2Gb(2G x 1)
4Gb(128M x 32)(NAND),2G(64M x 32)(LPDDR2)
4Gb(128M x 32)(NAND),4G(128M x 32)(LPDDR2)
4Gb(256M x 16)
4Gb(4G x 1)
8Gb(1G x 8)
32Gb(4G x 8)
64Gb(8G x 8)
256Gb(32G x 8)
512Kb(64K x 8)
8Gb(512M x 16)
16Gb(2G x 8)
1Gb(1G x 1)
128Gb(16G x 8)
4Gb(512M x 8)(NAND),2G(64M x 32)(LPDRAM)
4Gb(256M x 16)(NAND),2G(128M x 16)(LPDRAM)
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 105°C(TC)
0°C ~ 70°C(TA)
8-UDFN
24-TBGA
48-TFSOP(0.724,18.40mm wide)
63-VFBGA
121-WFBGA
152-VBGA
162-VFBGA
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-TSSOP(0.173,4.40mm wide)
48-TSOP
100-VBGA
114-LFBGA
130-VFBGA
137-VFBGA
168-WFBGA
63-VFBGA(9x11)
8-VLGA Exposed Pad