Total: 64
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
pipe
1Gb(128M x 8)
2Gb(128M x 16)
2Gb(256M x 8)
4Gb(512M x 8)
2Gb(2G x 1)
4Gb(256M x 16)
32Gb(4G x 8)
64Gb(8G x 8)
256Gb(32G x 8)
512Gb(64G x 8)
1Tb(128G x 8)
16Gb(2G x 8)
1Gb(1G x 1)
128Gb(16G x 8)
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
0°C ~ 70°C(TA)
48-TFSOP(0.724,18.40mm wide)
52-VLGA
100-LBGA
100-TBGA
152-LBGA
152-VBGA
mould
16-SOIC(0.295,7.50mm wide)
100-VBGA