Total: 228
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
pallet
TR
pipe
TR,CT,
CT,
256Mb(16M x 16)
256Mb(32M x 8)
512Mb(32M x 16)
512Mb(64M x 8)
1Gb(64M x 16)
1Gb(128M x 8)
2Gb(128M x 16)
2Gb(256M x 8)
4Gb(512M x 8)
4Gb(256M x 16)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
32Mb(4M x 8,2M x 16)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(16M x 8,8M x 16)
128Mb(8M x 16)
256Mb(32M x 8,16M x 16)
512Kb(64K x 8)
512Mb(64M x 8,32M x 16)
64Mb(8M x 8)
64Mb(8M x 8,4M x 16)
128Mb(4M x 32)
1Gb(32M x 32)
2Gb(64M x 32)
128Mb(FLASH-NOR),1Gb(FLASH-NAND)(16M x 8(FLASH-NOR),128M x 8(FLASH-NAND))
1Gb(NAND),512Mb(LPDDR2)
2Gb(NAND),1Gb(LPDDR)
1Gb(NAND),1Gb(LPDDR2)
-40°C ~ 85°C
-40°C ~ 85°C(TA)
-40°C ~ 95°C(TC)
-40°C ~ 105°C(TC)
0°C ~ 85°C(TC)
0°C ~ 70°C(TA)
0°C ~ 95°C(TC)
-40°C ~ 85°C(TC)
-25°C ~ 85°C(TC)
60-TFBGA
84-TFBGA
24-TBGA
48-TFSOP(0.724,18.40mm wide)
63-VFBGA
121-WFBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
96-TFBGA
200-WFBGA
48-VFBGA
130-VFBGA
134-VFBGA
56-TFBGA
28-DIP(0.600,15.24mm)
8-DIP(0.300,7.62mm)
FBGA
96-VFBGA
8-WLGA Exposed Pad
90-TFBGA
54-TFBGA
78-VFBGA
66-TSSOP (szerokość 0,400,10,16mm)
BGA
TSOP
SOP
TSOP32
TSOP-32
DIP
PLCC
DIP32
PLCC-32
PLCC32
DIP-32
DIE