Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
64Mb(8M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
75 MHz
15ms,5ms
24-TBGA
8-VDFN Exposed Pad