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K4A4G165WF-BCTD
SSDPEKNU512GZ
MT40A512M16LY-075:E
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GDDR1
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GDDR4
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GDDR6
LPDDR1
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LPDDR3
LPDDR4
LPDDR4X
LPDDR5
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Geil module
Intel Module
Crucial Module
Kinston Module
Samsung module
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Hynix module
Nanya module
Geil module
CPU
Core i3
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Core i7
Core i9
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Brand:
Samsung
Micron
Hynix
Winbond
nanya
ELPIDA
Etron
ISSI
ProMOS
Alliance Memory
Zentel
more
Memory format:
DRAM
-
more
Installation type:
-
Surface mount
more
packing:
TR,-,-
pallet
CT
bulk
TR
box
TR,CT
pipe
more
Part status:
On sale
Final sale
stop production
Not applicable to new design
more
Memory type:
Volatile
more
storage capacity :
512Mb
4 Gb
1 Gb
1Gb
2Gb
4Gb
16Gb
2 Gb
16 Gbit
512 Mbit
2 Gbit
1 Gbit
4 Gbit
8 Gbit
512Mb(32M x 16)
1Gb(64M x 16)
1Gb(128M x 8)
1Gb(256M x 4)
2Gb(128M x 16)
2Gb(256M x 8)
2Gb(512M x 4)
4Gb(512M x 8)
4Gb(1G x 4)
8Gb(512M x 16)
8Gb(2G x 4)
16Gb(1G x 16)
4Gb(256M x 16)
8Gb(1G x 8)
2GB
4GB
8GB
more
Voltage - Supply:
1.283V ~ 1.45V,1.425V ~ 1.575V
1.35 V
1.35V
1.5V
1.2V
-
1.283V ~ 1.45V
1.425V ~ 1.575V
more
working temperature :
0 ~ 85 °C
-40 ~ 95 °C
-40°C ~ 115°C(TC)
-40 ~ 105 °C
-40°C ~ 95°C(TC)
-40°C ~ 105°C(TC)
0°C ~ 95°C(TA)
-40°C ~ 85°C(TC)
-25°C ~ 85°C(TC)
0°C ~ 95°C(TC)
-40°C ~ 125°C(TC)
0°C ~ 85°C(TC)
more
Encapsulation/Housing:
FBGA
96-VFBGA
78-VFBGA
96-LFBGA
96TBGA
9FBGA
78FBGA
96FBGA
BGA-96
FPGA-96
FPGA-78
WFBGA-200
SMD
PBGA96
BGA96
FBGA96
FBGA78
BGA-78
TFBGA-78
BGA
96-TWBGA(10x14)
96-TWBGA(9x13)
FBGA-96
FBGA-78
FBGA82
96-TFBGA
96-FBGA
78-TFBGA
82-FBGA
more
choosed:
-40°C ~ 105°C(TC)
stop production
1Gb(64M x 16)
Volatile
Winbond
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