Total: 355
TI
ON
Microchip
ADI
NXP
Diodes
Cypress
Surface mount
bulk
pallet
TR
TR,CT
pipe
bulk,pallet
pallet,pallet
TR,CT,bulk
TR,bulk
bulk,pipe
TR,TR
GigaComm™
ECLinPS MAX™
100ES
Precision Edge®
SiGe
On sale
Final sale
stop production
3.3V
3V ~ 3.6V
3.135V ~ 3.465V
2.97V ~ 3.63V
2.375V ~ 2.625V,3V ~ 3.6V
3.15V ~ 3.45V
2.375V ~ 3.8V
2.375V ~ 3.465V
2.375V ~ 3.6V
3.135V ~ 3.8V
2.375V ~ 2.625V,3.135V ~ 3.465V
2.375V ~ 3.63V
2.37V ~ 3.6V
0°C ~ 70°C
-40°C ~ 85°C
-40°C ~ 105°C
-40°C ~ 85°C(TA)
-40°C ~ 125°C
-55°C ~ 125°C
-40°C ~ 110°C
mould
8-SOIC(0.154,3.90mm wide)
8-TSSOP(0.173,4.40mm wide)
20-TSSOP(0.173,4.40mm wide)
32-LQFP
40-VFQFN Exposed Pad
32-VFQFN Exposed Pad
48-VFQFN Exposed Pad
64-TQFP Exposed Pad
32-TQFP
48-TQFP
24-VFQFN Exposed Pad
16-VFQFN Exposed Pad
28-VFQFN Exposed Pad
28-LCC(feedthrough)
16-TSSOP(0.173,4.40mm wide)
38-TFSOP(0.173,4.40mm wide)
40-WFQFN Exposed Pad
24-TSSOP(0.173,4.40mm wide)
40-VFQFN Exposed Pad,CSP
16-WFQFN Exposed Pad
12-WFDFN Exposed Pad
48-WFQFN Exposed Pad
36-WFQFN Exposed Pad
24-VFQFN Exposed Pad,CSP
32-WFQFN Exposed Pad,CSP
12-TSSOP(0.118,3.00mm wide)
8-VFDFN Exposed Pad,8-MLF®
52-VFQFN Exposed Pad
44-VFQFN Exposed Pad,44-MLF®
32-TQFP Exposed Pad
32-LQFP Exposed Pad
32-QFP
16-VFQFN Exposed Pad,16-MLF®
LVCMOS
Clock
CML,HCSL,LVCMOS,LVDS,LVPECL
LVCMOS,LVPECL
LVCMOS,LVDS,LVPECL
LVDS,LVPECL
LVPECL
LVDS,LVPECL,LVTTL
CML,LVCMOS,LVDS,LVPECL
LVCMOS,LVTTL
LVCMOS,LVPECL,LVTTL
Clock,crystal
HSTL,LVPECL
CML,HCSL,LVDS,LVPECL
CMOS,LVDS,LVPECL
CML,LVDS,LVPECL
CML,CMOS,LVDS,LVPECL
HCSL,LVDS,LVHSTL,LVPECL,SSTL
CML,LVDS,LVPECL,SSTL
crystal
LVCMOS,LVTTL,crystal
CML,HCSL,LVDS,LVHSTL,LVPECL,SSTL
Differential Or single end
CML,HCSL,LVCMOS,LVDS,LVHSTL,LVPECL,SSTL
CML,LVDS,PECL
CML,HSTL,LVDS,LVPECL
CML,HCSL,LVCMOS,LVDS,LVPECL,SSTL
CML,HSTL,LVCMOS,LVDS,LVTTL,PECL
CML,LVCMOS,LVDS,LVPECL,LVTTL
CML,HCSL,HSTL,LVDS,LVPECL,SSTL
HCSL,LVCMOS,LVDS,LVHSTL,LVPECL,LVTTL,SSTL
LVCMOS,LVDS,LVPECL,LVTTL
CML,HSTL,LVCMOS,LVDS,LVTTL,SSTL-2,VML
CML,HSTL,LVDS,LVPECL,LVTTL,SSTL-2,VML