Total: 311
TI
ON
Microchip
ST
Infineon
ADI
-
Surface mount
Through-Hole
bulk
pallet
TR
TR,CT
pipe
TR,CT,bulk
TR,bulk
CT,bulk
TR,TR,CT
Automotive, AEC-Q100
IttyBitty®
Automotive, AEC-Q100, FLEXMOS™
FLEXMOS™
EiceDriver™
EiceDRIVER™
iMOTION™
CoreControl™
On sale
Final sale
stop production
Not applicable to new design
4.5V ~ 5.5V
2.7V ~ 5.5V
3.5V ~ 15V
4.75V ~ 5.25V
3.3V ~ 5V
10.8V ~ 13.2V
4.5V ~ 28V
7V ~ 26V
4.5V ~ 13.2V
3.15V ~ 5.5V
4.5V ~ 16V
4V ~ 36V
5V ~ 14V
4.5V ~ 18V
10V ~ 20V
25V(max)
4.6V ~ 13.2V
4V ~ 28V
13V ~ 20V
4.15V ~ 6V
4.15V ~ 7.5V
4.5V ~ 6.5V
7V ~ 10V
4.6V ~ 6V
10V ~ 13.5V
4.15V ~ 13.2V
10V ~ 13.2V
7V ~ 18.5V
6V ~ 16V
2.7V ~ 9V
2.75V ~ 30V
4.75V ~ 32V
7V ~ 32V
12V ~ 36V
11V ~ 50V
10V ~ 450V
9V ~ 24V
8V ~ 48V
3.5V ~ 135V
5V ~ 26V
9V ~ 70V
4.5V ~ 16.5V
1.8V ~ 6V
3V ~ 42V
11.4V ~ 12.6V
10V ~ 25V
10V ~ 17.5V
7V ~ 34V
13V ~ 17.5V
4.25V ~ 16V
8V ~ 18V
4.5V ~ 40V
6V ~ 36V
4.5V ~ 8.8V
6.8V ~ 8.8V
-40°C ~ 85°C(TA)
0°C ~ 70°C(TA)
-40°C ~ 125°C(TA)
-40°C ~ 150°C(TA)
-40°C ~ 150°C(TJ)
-40°C ~ 125°C(TJ)
-40°C ~ 105°C(TJ)
-40°C ~ 100°C(TA)
0°C ~ 85°C(TA)
-40°C ~ 85°C(TJ)
0°C ~ 125°C(TJ)
-55°C ~ 150°C(TJ)
-25°C ~ 125°C(TJ)
0°C ~ 150°C(TJ)
8-SOIC(0.154,3.90mm wide)
8-VDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
32-LQFP
20-SOIC(0.295,7.50mm wide)
20-DIP(0.300,7.62mm)
28-SOIC(0.295,7.50mm wide)
16-DIP(0.300,7.62mm)
16-SOIC(0.154,3.90mm wide)
14-TSSOP(0.173,4.40mm wide)
32-VFQFN Exposed Pad
28-TSSOP(0.173,4.40mm wide)
8-DIP(0.300,7.62mm)
8-VFDFN Exposed Pad
14-SOIC(0.154,3.90mm wide)
10-VFDFN Exposed Pad
8-TSSOP,8-MSOP(0.118,3.00mm wide)
18-SOIC(0.295,7.50mm wide)
18-DIP(0.300,7.62mm)
14-DIP(0.300,7.62mm)
16-VQFN Exposed Pad
16-VFQFN Exposed Pad
32-TSSOP(0.240,6.10mm wide)
8-WFDFN Exposed Pad
16-WFQFN Exposed Pad
24-LSSOP(0.154,3.90mm wide)Exposed Pad
10-TFSOP,10-MSOP(0.118,3.00mm wide)
10-WFDFN Exposed Pad
8-SOIC(0.154,3.90mm wide)Exposed Pad
16-TFSOP(0.118,3.00mm wide)Exposed Pad
10-TFSOP,10-MSOP(0.118,3.00mm wide)Exposed Pad
12-TSSOP(0.118,3.00mm wide)Exposed Pad
16-SOIC(0.154,3.90mm wide)14 feedthrough
8-VFDFN Exposed Pad,CSP
39-QFN
8-VFDFN Exposed Pad,8-MLF®
36-TFQFN Exposed Pad
16-TFSOP(0.118,3.00mm wide)12 feedthrough,Exposed Pad
TO-253-4,TO-253AA
32-TQFP Exposed Pad
4-UDFN Exposed Pad,4-TMLF®
4-UQFN
14-SOIC(0.154,3.90mm wide)Exposed Pad
41-PowerWFQFN
11-SIP,9 feedthrough
low side
High terminal
half-bridge
High pressure side or low pressure side
High pressure sideand Low voltage side
half-bridge,Low voltage side
one way
Stand alone
synchronization
3-phase
1
2
6
4
3
8
N Channel MOSFET
IGBT,N Channel MOSFET
IGBT
N Channel,P Channel MOSFET
IGBT,N Channel,P Channel MOSFET
P Channel MOSFET
0.8V,2V
1V,2V
0.7V,3.4V
0.8V,2.5V
0.8V,2.9V
0.6V,3.3V
1.2V,2V
2.4V,1.8V
0.8V,2.2V
1V,3V
0.8V,2.4V
0.8V,3V
2V,4.5V
0.5V,3.15V
0.65V,1.4V
0.6V,1.4V
1.8V,1.7V
0.6V,2V
0.7V,3.5V
1.5V,3.5V
1.1V,1.7V
0.9V,2.5V
0.7V,2.4V
0.7V,1.3V
0.9V,2.7V
0.7V,4V
0.6V,2.65V
Non-inverting
35 V
600 V
30 V
200 V
40 V
25 V
50 V
500 V
400 V
135 V
60 V
115 V
14 V
55 V
620 V
29 V
33 V
34 V
16ns,11ns
25ns,20ns
15ns,10ns
25ns,15ns
25ns,25ns
277ns(max),277ns(max)
20ns,20ns
14ns,11ns
18ns,10ns
1.4µs,1.4µs(max)
30ns,25ns
16ns,15ns
10ns,10ns
400ns,400ns
30ns,30ns
650µs,3ms(max)
15ns,13.5ns
700ns,500ns
90ns,40ns
1.7µs,2.5µs
20ns,16ns
14ns,9ns
18ns,14ns
15ns,12ns
60ns,26ns
250ns,200ns
48ns,24ns
30ns,40ns
1µs,1µs
30ns,8ns