Total: 139
TI
Microchip
ST
NXP
pallet
SAMA5D2
i.MX6
i.MX7D
i.MX6SX
Vybrid, VF5xxR
i.MX8MN
Vybrid, VF3xxR
Vybrid, VF3xx
Vybrid, VF6xx
i.MX7S
Vybrid, VF5xx
On sale
500MHz
400MHz
800MHz
1GHz
266MHz
1.0GHz
1.2GHz
1.4GHz
528MHz
900MHz
227MHz,1GHz
200MHz,800MHz
1.0GHz,133MHz
792MHz
500MHz,167MHz
266MHz,133MHz
400MHz,167MHz
400MHz,133MHz
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TJ)
-40°C ~ 105°C(TJ)
0°C ~ 85°C(TJ)
-20°C ~ 105°C(TJ)
0°C ~ 95°C(TJ)
272-LFBGA
176-LQFP Exposed Pad
196-TFBGA,CSBGA
289-LFBGA
289-TFBGA
361-TFBGA
A-HAB,ARM TZ,CAAM,CSU,SJC,SNVS
529-LFBGA
621-FBGA,FCBGA
400-LFBGA
364-LFBGA
541-LFBGA
306-TFBGA
488-TFBGA
ARM® Cortex®-A5
ARM® Cortex®-A7
ARM® Cortex®-A7,ARM® Cortex®-M4
ARM® Cortex®-A9,ARM® Cortex®-M4
ARM® Cortex®-A53,ARM® Cortex®-M4
ARM® Cortex®-A53,ARM® Cortex®-M7
ARM® Cortex®-A5 + Cortex®-M4
1 코어,32 bit
2 코어,32 bit
4 코어,64-비트
4 cores,64 bit/1 cores,32 bit
2 코어,64 bit
3 코어,64 bit
multi-media;NEON™ MPE
LPDDR1,LPDDR2,LPDDR3,DDR2,DDR3,DDR3L,QSPI
DDR2,DDR3,DDR3L,LPDDR1,LPDDR2,LPDDR3,QSPI
DDR3,DDR3L,LPDDR2,LPDDR3
LPDDR2,DDR3,DDR3L
LPDDR2,LPDDR3,DDR3,DDR3L
LPDDR2,LVDDR3,DDR3
DDR3L,DDR4,LPDDR4
LPDDR2,DDR3,DRAM
DDR3,LPDDR2,LVDDR3
No
Yes
keyboard,LCD,touch screen
Keypad,LCD
electrophoresis,LCD
keyboard,,LCD,MIPI
keyboard,LCD,LVDS
DCU,GPU,LCD,VideoADC,VIU
LCD,MIPI-CSI,MIPI-DSI
APEX2-CL,DCU(2D-ACE),ISP,MIPICSI2,VIU
LCD,MIPI-CSI
10/100Mbps(1)
10/100Mbps(2)
10/100/1000Mbps(1)
10/100/1000Mbps(2)
GbE
1Gbps
-
USB 2.0 + HSIC
USB 2.0 OTG + PHY(1)
USB 2.0 + PHY(1),USB 2.0 OTG + PHY(2)
USB 2.0 OTG + PHY(2)
USB 2.0 + PHY(1),USB 2.0 OTG + PHY(1)
1.8V,3.3V
3.3V
1.8V,2.8V,3.3V
1.8V,2.5V,2.8V,3.15V
1.0V,1.8V,3.3V
ARM TZ, Startup safety, Cryptography, RTIC, safety fuse box, safety JTAG, safety storage device, safety RTC
A-HAB,ARM TZ,CSU,SJC,SNVS
A-HAB,ARM TZ,CAAM,CSU,SNVS,system JTAG,TVDECODE
AES,ARM TZ,guide,CSE,OCOTP_CTRL,system JTAG
ARM TZ,hash,RNG,RTC,RTIC,Secure JTAG,SNVS,TZ ASC,TZ WDOG
ARM TZ,CAAM,HAB,OCRAM,RDC,SJC,SNVS
ARM TZ,CAAM,HAB,RTIC,Secure JTAG,SNVS,falsify,TZ ASC,TZ WDOG