Total: 401
TI
Microchip
ST
NXP
bulk
pallet
TR
bulk,pallet
pallet,pallet
bulk,bulk
bulk,pallet,pallet
Sitara™
i.MX7D
i.MX6SX
MPC83xx
QorIQ P1
MPC85xx
QorIQ Qonverge BSC
On sale
stop production
300MHz
500MHz
400MHz
800MHz
1GHz
600MHz
266MHz
1.0GHz
1.2GHz
533MHz
227MHz,1GHz
833MHz
200MHz,800MHz
1.333GHz
1.067GHz
267MHz
333MHz
667MHz
-40°C ~ 105°C
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
-40°C ~ 125°C(TJ)
0°C ~ 105°C(TA)
-40°C ~ 105°C(TJ)
0°C ~ 85°C(TJ)
0°C ~ 125°C(TA)
-20°C ~ 105°C(TJ)
0°C ~ 90°C(TJ)
-40°C ~ 90°C(TJ)
0°C ~ 95°C(TJ)
0°C ~ 105°C
0°C ~ 90°C(TA)
491-LFBGA
A-HAB,ARM TZ,CAAM,CSU,SJC,SNVS
400-LFBGA
620-BBGA Exposed Pad
780-BFBGA,FCBGA
689-BBGA Exposed Pad
783-BBGA,FCBGA
516-BBGA Exposed Pad
672-LBGA
541-LFBGA
488-TFBGA
520-FBGA,FCBGA
783-BFBGA,FCBGA
1023-BBGA,FCBGA
457-FBGA
ARM® Cortex®-A9
ARM® Cortex®-A7,ARM® Cortex®-M4
ARM® Cortex®-A9,ARM® Cortex®-M4
PowerPC e300c3
PowerPC e300
PowerPC e500v2
PowerPC e500
PowerPC e300c4s
1 코어,32 bit
2 코어,32 bit
-
multi-media;NEON™ MPE
multi-media;NEON™ SIMD
signal communication;CPM
safety;SEC
signal processing;SPE
signal processing;SPE,safety;SEC
safety;SEC 3.3
signal communication;QUICC engine
signal communication;CPM,safety;SEC
signal communication;QUICC Engine, security;SEC
safety;SEC 2.2
signal processing;SC3850
signal processing;SC3850,safety;SEC 4.4
signal processing;SC3850 - two
safety;SEC 4.2
safety;SEC 3.0
DDR,SDRAM
DDR3,DDR3L,LPDDR2,LPDDR3
DDR,DDR2
DDR3,DDR3L
LPDDR2,DDR3,DDR3L
DDR
LPDDR2,LPDDR3,DDR3,DDR3L
LPDDR2,LVDDR3,DDR3
DDR,DDR2,SDRAM
No
Keypad,LCD
TSC,WXGA
keyboard,,LCD,MIPI
10/100/1000Mbps(2)
USB 2.0(1)
USB 2.0 + PHY(1)
USB 2.0 + PHY(2)
USB 2.0 + PHY(1),USB 2.0 OTG + PHY(2)
1.8V,3.3V
1.8V,2.5V,3.3V
2.5V,3.3V
1.8V,2.5V,2.8V,3.15V
Cryptography
Cryptography, random number generator device
Password acceleration device
A-HAB,ARM TZ,CAAM,CSU,SNVS,system JTAG,TVDECODE
Startup safety,Cryptography,Random number Generator device