Total: 58
TI
Microchip
ST
NXP
pallet
i.MX6D
i.MX50
i.MX6DL
i.MX51
i.MX6SLL
i.MX6DP
i.MX6S
i.MX6Q
i.MX53
On sale
Final sale
stop production
Not applicable to new design
800MHz
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
0°C ~ 70°C(TA)
-40°C ~ 125°C(TJ)
-40°C ~ 105°C(TJ)
-20°C ~ 70°C(TA)
-20°C ~ 105°C(TJ)
-20°C ~ 85°C(TC)
529-LFBGA
624-FBGA,FCBGA
621-FBGA,FCBGA
400-LFBGA
624-LFBGA
416-LFBGA
527-LFBGA
569-LFBGA
529-FBGA
527-TFBGA
416-VFBGA
ARM® Cortex®-A8
ARM® Cortex®-A9
ARM® Cortex®-A53,ARM® Cortex®-M4
1 코어,32 bit
2 코어,32 bit
4 코어,32 bit
4 cores,64 bit/1 cores,32 bit
multi-media;NEON™ MPE
multi-media;NEON™ SIMD
LPDDR,LPDDR2,DDR2
LPDDR,DDR2
LPDDR2,LVDDR3,DDR3
LPDDR2,LPDDR3
DDR3,DDR3L,LPDDR2
DDR3,LPDDR2,LVDDR3
LPDDR2,DDR3L,DDR3
LPDDR2,DDR2,DDR3
DDR2,DDR3,LPDDR2
Yes
LCD
Keypad,LCD
keyboard,LCD,LVDS
EPDC,LCD
APEX2-CL,DCU(2D-ACE),ISP,LCD,MIPICSI2,video,VIU
HDMI,Keypad,LCD,LVDS,MIPI/DSI,parallel
10/100Mbps(1)
-
10/100/1000Mbps(1)
1Gbps
SATA 3Gbps(1)
SATA 1.5Gbps(1)
USB 2.0 + PHY(2)
USB 2.0(3),USB 2.0 + PHY(1)
USB 2.0 OTG + PHY(2)
USB 2.0 + PHY(4)
USB 2.0 + PHY(3),USB 2.0 OTG + PHY(1)
USB 2.0(2),USB 2.0 + PHY(2)
USB 2.0(2),USB 2.0 + PHY(1),USB 2.0 OTG + PHY(1)
1.8V,2.5V,2.8V,3.3V
1.2V,1.875V,2.775V,3.0V
1.2V,1.8V,2.5V,3.3V
1V,1.8V,3.3V
1.3V,1.8V,2.775V,3.3V
ARM TZ, Startup safety, Cryptography, RTIC, safety fuse box, safety JTAG, safety storage device, safety RTC
A-HAB,ARM TZ,CSU,SJC,SNVS
ARM TZ,A-HAB,CAAM,CSU,SJC,SNVS
ARM TZ, Startup safety, Cryptography, RTIC, safety fuse box, safety JTAG, safety storage device, safety RTC, tamper detection
Startup safety,Cryptography,safety JTAG
AES,ARM TZ,guide,CSE,OCOTP_CTRL,system JTAG