Total: 55
TI
Microchip
ST
NXP
pallet,pallet
i.MX6
i.MX6UL
MPC83xx
MPC82xx
MPC74xx
MPC85xx
MPC86xx
MPC8xx
M683xx
i.MX21
i.MXL
On sale
stop production
Not applicable to new design
16MHz
66MHz
100MHz
150MHz
50MHz
25MHz
300MHz
500MHz
400MHz
1.5GHz
266MHz
350MHz
450MHz
533MHz
1.25GHz
528MHz
833MHz
1.333GHz
81MHz
1.067GHz
1.066GHz
133MHz
200MHz
667MHz
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
0°C ~ 70°C(TA)
0°C ~ 95°C(TA)
0°C ~ 105°C(TA)
-40°C ~ 105°C(TJ)
-40°C ~ 115°C(TA)
-40°C ~ 100°C(TA)
-40°C ~ 95°C(TA)
0°C ~ 95°C(TJ)
272-LFBGA
144-LQFP
144-BQFP
289-LFBGA
256-BBGA
620-BBGA Exposed Pad
516-BBGA
783-BBGA,FCBGA
357-BBGA
360-BCBGA,FCCBGA
480-LBGA Exposed Pad
352-LBGA
672-LBGA
740-LBGA
225-LFBGA
783-BFBGA,FCBGA
241-BEPGA
1023-BFBGA,FCBGA
1023-BBGA,FCBGA
994-BCBGA,FCCBGA
1023-BCBGA,FCCBGA
ARM920T
ARM926EJ-S
CPU32
CPU32+
PowerPC 603e
ARM® Cortex®-A7
PowerPC G2_LE
PowerPC e300
PowerPC G4
M68000
PowerPC e500v2
PowerPC e500
PowerPC G2
PowerPC
PowerPC e600
1 코어,32 bit
2 코어,32 bit
1 코어,8/16 bit
-
multi-media;NEON™ MPE
multi-media;NEON™ SIMD
signal communication;CPM
signal communication;RISC CPM
safety;SEC
signal processing;SPE
signal communication;QUICC engine
signal communication;QUICC Engine, security;SEC
DDR,SDRAM
SDRAM
DRAM
DDR,DDR2
LPDDR2,DDR3,DDR3L
DDR2,DDR3
DDR
DRAM,SDRAM
DDR,DDR2,SDRAM
No
LCD
Keypad,LCD
electrophoresis,LCD
LCD,LVDS
LCD,video
DIU,LCD
10/100Mbps(1)
10/100Mbps(2)
10/100/1000Mbps(1)
10Mbps(1)
10/100Mbps(3)
10/100/1000Mbps(2)
10/100/1000Mbps(3)
10Mbps(4),10/100Mbps(1)
10/100/1000Mbps(4)
10Mbps(1),10/100Mbps(1)
10Mbps(2),10/100Mbps(2)
10/100Mbps(1),10/100/1000Mbps(2)
USB 2.0(1)
USB 2.0 + PHY(2)
USB 2.0 OTG + PHY(1)
USB 1.x(1)
USB 1.x(2)
3.3V
1.8V,2.5V,3.3V
2.5V,3.3V
5.0V
1.8V,3.0V
1.8V,2.8V,3.3V
1.2V,1.35V,1.5V,1.8V,2.5V,2.8V,3.3V
1.5V,1.8V,2.5V,3.3V
Cryptography, random number generator device
A-HAB,ARM TZ,CSU,SJC,SNVS
ARM TZ,A-HAB,CAAM,CSU,SJC,SNVS