Total: 144
TI
Microchip
ST
NXP
bulk
pallet
TR,CT
pipe
bulk,pallet
pallet,pallet
TR,bulk
SAM9G
SAM9M
SAM9CN
Sitara™
OMAP-L1x
i.MX7D
MPC83xx
i.MX28
stop production
80MHz
300MHz
500MHz
400MHz
800MHz
600MHz
1.5GHz
266MHz
456MHz
375MHz
1.0GHz
1.2GHz
720MHz
275MHz
454MHz
133MHz
200MHz
333MHz
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TJ)
0°C ~ 105°C(TA)
-40°C ~ 105°C(TJ)
-20°C ~ 70°C(TA)
-20°C ~ 105°C(TJ)
0°C ~ 90°C(TJ)
-40°C ~ 90°C(TJ)
0°C ~ 95°C(TJ)
176-LQFP Exposed Pad
217-LFBGA
324-TFBGA
289-LFBGA
256-BGA
324-LFBGA
247-LFBGA
361-LFBGA
298-LFBGA
491-LFBGA
760-BFBGA,FCBGA
684-BFBGA,FCBGA
1031-BFBGA,FCBGA
484-BBGA Exposed Pad
489-LFBGA
541-LFBGA
488-TFBGA
369-LFBGA
ARM926EJ-S
ARM® Cortex®-A8
ARM® Cortex®-A15
ARM® Cortex®-A9
ARM® Cortex®-A7,ARM® Cortex®-M4
PowerPC e300c3
1 코어,32 bit
2 코어,32 bit
-
multi-media;NEON™ MPE
multi-media;NEON™ SIMD
Control system; CP15
signal processing;C674x,System control;CP15
DSP,BB2D,IPU,IVA,GPU,VPE
multi-media;GPU,IPU,VFP
data DCP
signal communication;QUICC engine
LPDDR,LPSDR,DDR2,SDR,SRAM
LPDDR,LPDDR2,DDR2,SDR,SRAM
SDRAM
LPDDR,DDR2
LPDDR,DDR2,DDR3,DDR3L
LPDDR2,DDR3,DDR3L
DDR3,SRAM
DDR2,DDR3
DDR2,LPDDR
LPDDR2,LPDDR3,DDR3,DDR3L
DDR2
LVDDR,LVDDR2,DDR2
No
Yes
LCD,touch screen
LCD
LCD,touch screen,Video decoder
TSC,WXGA
HDMI
HDMI,HDVPSS
keyboard,,LCD,MIPI
Keypad,LCD,touch screen
10/100Mbps
10/100Mbps(1)
10/100/1000Mbps(1)
10/100Mbps(3)
10/100/1000Mbps(2)
GbE
SATA 3Gbps(1)
USB 2.0(3)
USB 2.0(2)
USB 2.0(1)
USB 2.0 + PHY(1)
USB 1.1 + PHY(1),USB 2.0 + PHY(1)
USB 2.0 + PHY(2)
USB 2.0(3),USB 2.0 + PHY(1)
USB 2.0(1),USB 3.0(1)
USB 2.0 + PHY(1),USB 2.0 OTG + PHY(2)
1.8V,3.3V
Cryptography
Cryptography, random number generator device
Startup safety,Cryptography
Password acceleration device
Startup safety,Cryptography,Hardware ID
A-HAB,ARM TZ,CAAM,CSU,SJC,SNVS