Total: 76
TI
Microchip
ST
NXP
pallet,pallet
SAM9CN
Sitara™
OMAP-35xx
OMAP-L1x
MPC83xx
MPC82xx
MPC74xx
MPC85xx
MPC86xx
MPC8xx
M683xx
i.MX21
i.MXL
On sale
stop production
Not applicable to new design
16MHz
66MHz
100MHz
150MHz
50MHz
25MHz
300MHz
500MHz
400MHz
600MHz
1.5GHz
266MHz
350MHz
450MHz
456MHz
375MHz
720MHz
1.25GHz
833MHz
1.333GHz
81MHz
1.067GHz
1.066GHz
133MHz
200MHz
667MHz
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
0°C ~ 70°C(TA)
0°C ~ 95°C(TA)
-40°C ~ 125°C(TJ)
0°C ~ 105°C(TA)
-40°C ~ 105°C(TJ)
-40°C ~ 115°C(TA)
-40°C ~ 100°C(TA)
-45°C ~ 85°C(TA)
-40°C ~ 95°C(TA)
0°C ~ 90°C(TJ)
-40°C ~ 90°C(TJ)
0°C ~ 90°C(TA)
144-LQFP
176-LQFP Exposed Pad
144-BQFP
289-LFBGA
256-BGA
256-BBGA
247-LFBGA
361-LFBGA
515-VFBGA,FCBGA
423-LFBGA,FCBGA
620-BBGA Exposed Pad
516-BBGA
783-BBGA,FCBGA
357-BBGA
360-BCBGA,FCCBGA
480-LBGA Exposed Pad
352-LBGA
225-LFBGA
783-BFBGA,FCBGA
241-BEPGA
1023-BFBGA,FCBGA
1023-BBGA,FCBGA
994-BCBGA,FCCBGA
1023-BCBGA,FCCBGA
ARM920T
ARM926EJ-S
CPU32
CPU32+
PowerPC 603e
ARM® Cortex®-A8
PowerPC G2_LE
PowerPC e300
PowerPC G4
M68000
PowerPC e500v2
PowerPC e500
PowerPC G2
PowerPC
PowerPC e600
1 코어,32 bit
2 코어,32 bit
1 코어,8/16 bit
-
multi-media;NEON™ SIMD
signal communication;CPM
Control system; CP15
signal processing;C674x,System control;CP15
signal communication;RISC CPM
signal processing;SPE
signal communication;QUICC engine
LPDDR,LPDDR2,DDR2,SDR,SRAM
DDR,SDRAM
SDRAM
DRAM
DDR,DDR2
LPDDR,DDR2
LPDDR
DDR2,DDR3
DRAM,SDRAM
DDR,DDR2,SDRAM
No
LCD,touch screen
LCD
Keypad,LCD
LCD,video
DIU,LCD
10/100Mbps(1)
10/100Mbps(2)
10Mbps(1)
10/100Mbps(3)
10/100/1000Mbps(2)
10/100/1000Mbps(3)
10Mbps(4),10/100Mbps(1)
10/100/1000Mbps(4)
10Mbps(1),10/100Mbps(1)
10Mbps(2),10/100Mbps(2)
10/100Mbps(1),10/100/1000Mbps(2)
SATA 3Gbps(1)
SATA 3Gbps(2)
USB 2.0(3)
USB 2.0(2)
USB 2.0(1)
USB 2.0 + PHY(1)
USB 1.1 + PHY(1),USB 2.0 + PHY(1)
USB 1.x(3),USB 2.0(1)
USB 2.0 + PHY(2)
USB 1.x(1)
USB 1.x(2)
1.8V,3.3V
3.3V
1.8V,2.5V,3.3V
2.5V,3.3V
5.0V
1.8V,3.0V
1.5V,1.8V,2.5V,3.3V