Total: 369
TI
Microchip
ST
NXP
pallet
SIAP™
SPEAr®
MPC82xx
M680x0
MPC86xx
MPC8xx
M683xx
MPC6xx
On sale
stop production
Not applicable to new design
16MHz
66MHz
80MHz
100MHz
40MHz
50MHz
25MHz
20MHz
300MHz
250MHz
75MHz
400MHz
266MHz
233MHz
450MHz
81MHz
133MHz
166MHz
200MHz
333MHz
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
0°C ~ 70°C(TA)
0°C ~ 95°C(TA)
-40°C ~ 85°C(TC)
0°C ~ 105°C(TA)
-40°C ~ 115°C(TA)
-40°C ~ 100°C(TA)
0°C ~ 85°C(TA)
-40°C ~ 95°C(TA)
-40°C ~ 110°C(TC)
-40°C ~ 95°C(TJ)
144-LQFP
100-LQFP
256-LFBGA
208-BFQFP
256-TFBGA
160-BQFP
240-BFQFP
256-BBGA
240-BFCQFP
255-BCBGA Exposed Pad
255-BCGA
420-FBGA
516-BBGA
357-BBGA
480-LBGA Exposed Pad
352-LBGA
255-BCBGA,FCCBGA
357-BGA
206-BPGA
255-BBGA
304-LBGA Exposed Pad
ARM926EJ-S
ARM7TDMI
CPU32
ARM® Cortex®-R4
CPU32+
PowerPC 603e
PowerPC G2_LE
M68000
MPC860
PowerPC G2
PowerPC
68060
1 코어,32 bit
2 코어,32 bit
1 코어,8/16 bit
-
signal processing;OakDSP
signal communication;CPM
ARM® Cortex®-M3
signal communication;RISC CPM
SDRAM
DRAM
DDR,DDR2
DRAM,SDRAM
No
LCD,touch screen
LCD,video
10/100Mbps(2)
10/100/1000Mbps(1)
10Mbps(1)
10/100Mbps(3)
10Mbps(4),10/100Mbps(1)
10Mbps(2)
10Mbps(4)
10Mbps(1),10/100Mbps(1)
10Mbps(2),10/100Mbps(2)
10Mbps(2),10/100Mbps(1)
USB 2.0(1)
USB 2.0 + PHY(3)
USB 1.x(1)
3.3V