Total: 217
TI
Microchip
ST
NXP
pallet
SAM9X
SAM9G
SAM9N
SAM9M
SAM9CN
i.MX35
MPC83xx
MPC52xx
Vybrid, VF5xxR
MPC82xx
MPC74xx
i.MX25
MPC7xx
On sale
stop production
Not applicable to new design
400MHz
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
0°C ~ 70°C(TA)
-40°C ~ 125°C(TA)
0°C ~ 105°C(TA)
-20°C ~ 70°C(TA)
0°C ~ 85°C(TA)
0°C ~ 125°C(TA)
217-LFBGA
324-TFBGA
247-LFBGA
247-TFBGA
247-VFBGA
400-LFBGA
620-BBGA Exposed Pad
272-BBGA
473-LFBGA
364-LFBGA
516-BBGA
689-BBGA Exposed Pad
360-BCBGA,FCCBGA
516-BBGA Exposed Pad
489-LFBGA
668-BBGA Exposed Pad
352-LBGA
672-LBGA
740-LBGA
347-LFBGA
360-CLGA,FCCLGA
360-BBGA,FCBGA
ARM926EJ-S
ARM® Cortex®-A5
PowerPC 603e
ARM1136JF-S
PowerPC e300c3
PowerPC G2_LE
PowerPC e300
PowerPC G4
PowerPC e300c4s
PowerPC
1 코어,32 bit
-
multi-media;NEON™ MPE
signal communication;RISC CPM
safety;SEC
safety;SEC 3.3
signal communication;QUICC engine
signal communication;RISC CPM,safety;SEC
signal communication;QUICC Engine, security;SEC
safety;SEC 2.2
multi-media;IPU,VFP
safety;SEC 3.0
LPDDR,LPDDR2,DDR2,DDR,SDR,SRAM
DDR2,SDRAM,SRAM
LPDDR,LPSDR,DDR2,SDR,SRAM
SDRAM,SRAM
LPDDR,LPDDR2,DDR2,SDR,SRAM
DDR,SDRAM
SDRAM
DDR,DDR2
LPDDR,DDR2
DDR
DDR2
LPDDR2,DDR3,DRAM
DRAM,SDRAM
LPDDR,DDR,DDR2
No
LCD,touch screen
LCD,touch screen,Video decoder
Keypad
Keypad,KPP,LCD
DCU,GPU,LCD,VideoADC,VIU
Keypad,LCD,touch screen
10/100Mbps
10/100Mbps(1)
10/100Mbps(2)
10/100/1000Mbps(1)
10/100Mbps(3)
10/100/1000Mbps(2)
10/100/1000Mbps(3)
SATA 3Gbps(2)
SATA 3Gbps(4)
USB 2.0(3)
USB 2.0(2)
USB 2.0(1)
USB 2.0 + PHY(1)
USB 2.0 + PHY(2)
USB 2.0 OTG + PHY(1)
USB 1.1(2)
USB 1.x(1)
1.8V,2.5V,3.0V,3.3V
1.8V,3.3V
3.3V
1.8V,2.5V,3.3V
1.8V,2.0V,2.5V,2.7V,3.0V,3.3V
2.5V,3.3V
2.0V,2.5V,2.7V,3.0V,3.3V
Cryptography
Cryptography, random number generator device
Safety fuse box,safety JTAG
ARM TZ,hash,RNG,RTC,RTIC,Secure JTAG,SNVS,TZ ASC,TZ WDOG
Startup safety,Cryptography,Safety fuse box,safety JTAG,Safety storage device,Tamper Detection