Total: 30
TI
Microchip
ST
NXP
pallet
i.MX7D
QorIQ® Layerscape
i.MX6DL
i.MX6SLL
i.MX6S
i.MX53
On sale
Final sale
stop production
1GHz
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TJ)
0°C ~ 105°C(TA)
-20°C ~ 70°C(TA)
-20°C ~ 105°C(TJ)
0°C ~ 95°C(TJ)
-20°C ~ 85°C(TC)
621-FBGA,FCBGA
432-TFBGA
624-LFBGA
448-BFBGA
483-BCBGA,FCCBGA
488-TFBGA
529-FBGA
ARM® Cortex®-A8
ARM® Cortex®-A9
ARM® Cortex®-A7,ARM® Cortex®-M4
ARM® Cortex®-A53,ARM® Cortex®-M4
ARM® Cortex®-A72
PowerPC G4
1 코어,32 bit
1 코어,64 bit
2 코어,32 bit
4 cores,64 bit/1 cores,32 bit
2 코어,64 bit
-
multi-media;NEON™ MPE
multi-media;NEON™ SIMD
multi-media;SIMD
DDR3,DDR3L,LPDDR2,LPDDR3
LPDDR2,LVDDR3,DDR3
LPDDR2,LPDDR3
DDR3,DDR3L,LPDDR2
DDR3L SDRAM,DDR4 SDRAM
LPDDR2,DDR2,DDR3
No
Yes
Keypad,LCD
keyboard,,LCD,MIPI
EPDC,LCD
APEX2-CL,DCU(2D-ACE),ISP,LCD,MIPICSI2,video,VIU
10/100Mbps(1)
10/100/1000Mbps(1)
10/100/1000Mbps(2)
1Gbps
1Gbps(1),2.5Gbps(5)
SATA 6Gbps(1)
SATA 1.5Gbps(1)
USB 2.0 + PHY(1),USB 2.0 OTG + PHY(2)
USB 2.0 OTG + PHY(2)
USB 2.0 + PHY(4)
USB 2.0(2),USB 2.0 + PHY(2)
USB 2.0(2),USB 2.0 + PHY(1),USB 2.0 OTG + PHY(1)
1.8V,3.3V
1.8V,2.5V,2.8V,3.3V
1.2V,1.8V,2.5V,3.3V
1V,1.8V,3.3V
1.5V,1.8V,2.5V
1.3V,1.8V,2.775V,3.3V
A-HAB,ARM TZ,CSU,SJC,SNVS
ARM TZ, Startup safety, Cryptography, RTIC, safety fuse box, safety JTAG, safety storage device, safety RTC, tamper detection
AES,ARM TZ,guide,CSE,OCOTP_CTRL,system JTAG
A-HAB,ARM TZ,CAAM,CSU,SJC,SNVS