Total: 15
TI
Microchip
ST
NXP
pallet
TR
bulk,pallet
i.MX6SLL
i.MX6S
i.MX53
On sale
stop production
1GHz
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TJ)
0°C ~ 105°C(TA)
-20°C ~ 70°C(TA)
-20°C ~ 105°C(TJ)
0°C ~ 95°C(TJ)
-20°C ~ 85°C(TC)
432-TFBGA
624-LFBGA
483-BCBGA,FCCBGA
529-FBGA
ARM® Cortex®-A8
ARM® Cortex®-A9
PowerPC G4
1 코어,32 bit
multi-media;NEON™ SIMD
multi-media;SIMD
-
LPDDR2,LVDDR3,DDR3
LPDDR2,LPDDR3
DDR3,DDR3L,LPDDR2
LPDDR2,DDR2,DDR3
No
Yes
Keypad,LCD
EPDC,LCD
10/100Mbps(1)
10/100/1000Mbps(1)
SATA 1.5Gbps(1)
USB 2.0 OTG + PHY(2)
USB 2.0 + PHY(4)
USB 2.0(2),USB 2.0 + PHY(2)
USB 2.0(2),USB 2.0 + PHY(1),USB 2.0 OTG + PHY(1)
1.8V,2.5V,2.8V,3.3V
1.2V,1.8V,2.5V,3.3V
1.5V,1.8V,2.5V
1.3V,1.8V,2.775V,3.3V
A-HAB,ARM TZ,CSU,SJC,SNVS
ARM TZ, Startup safety, Cryptography, RTIC, safety fuse box, safety JTAG, safety storage device, safety RTC, tamper detection