Total: 222
TI
Microchip
ST
NXP
bulk
pallet
TR
box
pipe
bulk,pallet
pallet,pallet
SPEAr®
Sitara™
i.MX7D
i.MX6SX
Vybrid, VF5xxR
QorIQ P1
MPC85xx
MPC86xx
Vybrid, VF3xxR
QorIQ P2
QorIQ Qonverge BSC
On sale
stop production
Not applicable to new design
500MHz
800MHz
1GHz
1.5GHz
1.0GHz
1.2GHz
1.25GHz
1.4GHz
227MHz,1GHz
200MHz,800MHz
1.333GHz
266MHz,133MHz
400MHz,133MHz
1.067GHz
333MHz
667MHz
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
0°C ~ 85°C(TC)
-40°C ~ 125°C(TA)
-40°C ~ 85°C(TC)
-40°C ~ 125°C(TJ)
0°C ~ 105°C(TA)
0°C ~ 85°C(TJ)
0°C ~ 125°C(TA)
-20°C ~ 105°C(TJ)
0°C ~ 95°C(TJ)
-40°C ~ 100°C(TC)
176-LQFP Exposed Pad
420-FBGA
1089-BFBGA,FCBGA
A-HAB,ARM TZ,CAAM,CSU,SJC,SNVS
400-LFBGA
364-LFBGA
780-BFBGA,FCBGA
689-BBGA Exposed Pad
561-FBGA
541-LFBGA
488-TFBGA
1023-BFBGA,FCBGA
1023-BBGA,FCBGA
1023-BCBGA,FCCBGA
689-TePBGA II
457-FBGA
1023-BCBGA,FCBGA
ARM926EJ-S
ARM® Cortex®-A15
ARM® Cortex®-A7,ARM® Cortex®-M4
ARM® Cortex®-A9,ARM® Cortex®-M4
PowerPC e500v2
PowerPC e500
ARM® Cortex®-A5 + Cortex®-M4
PowerPC e600
2 코어,32 bit
-
multi-media;NEON™ MPE
network
signal processing;SPE
signal processing;SPE,safety;SEC
safety;SEC 3.3
signal communication;QUICC engine
signal communication;QUICC engine,safety;SEC 3.3
signal processing;SC3850,safety;SEC 4.4
signal processing;SC3850 - two
DDR3,DDR3L,LPDDR2,LPDDR3
DDR,DDR2
DDR3,DDR3L
DDR3,SRAM
DDR2,DDR3
LPDDR2,LPDDR3,DDR3,DDR3L
LPDDR2,LVDDR3,DDR3
LPDDR2,DDR3,DRAM
DDR3
No
LCD,touch screen
Keypad,LCD
keyboard,,LCD,MIPI
DCU,GPU,LCD,VideoADC,VIU
10/100Mbps(2)
10/100/1000Mbps(1)
10/100/1000Mbps(2)
1GBE(8)
10/100/1000Mbps(3)
10/100/1000Mbps(4)
USB 2.0(1)
USB 2.0 + PHY(3)
USB 2.0 + PHY(1)
USB 2.0 + PHY(2)
USB 3.0(2)
USB 2.0 OTG + PHY(1)
USB 2.0 + PHY(1),USB 2.0 OTG + PHY(2)
1.8V,3.3V
3.3V
1.8V,2.5V,3.3V
2.5V,3.3V
1.35V,1.5V,1.8V,3.3V
1.8V,2.5V,2.8V,3.15V
1.5V,1.8V,2.5V,3.3V
Cryptography, random number generator device
A-HAB,ARM TZ,CAAM,CSU,SNVS,system JTAG,TVDECODE
ARM TZ,hash,RNG,RTC,RTIC,Secure JTAG,SNVS,TZ ASC,TZ WDOG
Startup safety,Cryptography,Random number Generator device