Total: 88
Samsung
Micron
Hynix
Winbond
nanya
ELPIDA
Etron
ISSI
ProMOS
Alliance Memory
Zentel
DRAM
Surface mount
bulk
pallet
TR
box
TR,CT
CT
pipe
Volatile
256Mb(16M x 16)
1Gb(128M x 8)(NAND),512M(32M x 16)(LPDDR2)
2Gb(256M x 8)(NAND),1G(32M x 32)(LPDDR2)
2Gb(256M x 8)(NAND),2G(64M x 32)(LPDDR2)
2Gb(2G x 1)
128Mb(16M x 8)
128Mb(16M x 8,8M x 16)
128Mb(32M x 4)
128Mb(8M x 16)
256Mb(32M x 8,16M x 16)
1Gb(128M x 8,64M x 16)
8Mb(512K x 16)
16Mb Flash Memory,4Mb RAM
16Mb(512K x 32)
32Mb(1M x 32)
384Gb(48G x 8)
2.3V ~ 2.7V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TC)
0°C ~ 85°C(TC)
0°C ~ 70°C(TA)
60-FBGA
60-TFBGA
32-LCC(J feedthrough)
40-TFSOP(0.724,18.40mm wide)
44-SOIC(0.496,12.60mm wide)
8-UDFN Exposed Pad
46-TFBGA
153-VFBGA
153-WFBGA
66-TSSOP (0,400,10,16mm)
66-TSSOP (szerokość 0,400,10,16mm)