Total: 110
Samsung
Micron
Hynix
Winbond
nanya
ELPIDA
Etron
ISSI
ProMOS
Alliance Memory
Zentel
DRAM
Surface mount
bulk
pallet
TR
box
TR,CT
bag
Volatile
256Mb(16M x 16)
256Mb(32M x 8)
512Mb(32M x 16)
512Mb(64M x 8)
512Mb(128M x 4)
1Gb(64M x 16)
1Gb(128M x 8)
4Gb(512M x 8)(NAND),4G(128M x 32)(LPDDR4)
8Gb(1G x 8)
8Gb(8G x 1)
256Gb(32G x 8)
128Mb(16M x 8)
128Mb(8M x 16)
1Gb(128M x 8,64M x 16)
8Gb(2G x 4)
16Gb(1G x 16)
16Gb(4G x 4)
48Gb(1.5G x 32)
48Gb(1.5G x32)
8Mb(512K x 16)
16Mb(1M x 16)
16Mb(512K x 32)
32Mb(8M x 4)
64Mb(8M x 8,4M x 16)
2Gb(256M x 8,128M x 16)
1Gb(1G x 1)
384Gb(48G x 8)
768Gb(96G x 8)
1.125Tb(144G x 8)
3Tb(384G x 8)
1.55V ~ 1.9V
1.7V ~ 1.9V
1.14V ~ 1.3V,1.7V ~ 1.95V
2.3V ~ 3.6V
3V ~ 3.6V
2.5V ~ 3.3V
3.135V ~ 3.465V
2.3V ~ 2.7V
2.5V ~ 2.7V
-40°C ~ 85°C(TA)
-40°C ~ 125°C(TC)
0°C ~ 70°C(TA)
0°C ~ 95°C(TC)
0°C ~ 95°C(TA)
-30°C ~ 105°C(TC)
-30°C ~ 85°C(TC)
-40°C ~ 85°C(TC)
-20°C ~ 85°C(TA)
60-FBGA
60-TFBGA
24-TBGA
48-TFSOP(0.724,18.40mm wide)
152-TBGA
162-VFBGA
8-SOIC(0.209,5.30mm wide)
16-SOIC(0.295,7.50mm wide)
40-TFSOP(0.724,18.40mm wide)
32-TFSOP(0.488,12.40mm wide)
46-TFBGA
46-VFBGA
48-TFSOP(0.173,4.40mm wide)
56-TFBGA,CSPBGA
56-VFBGA
66-LFBGA,CSPBGA
80-BQFP
80-LBGA
88-TFBGA,CSPBGA
88-VFBGA,CSPBGA
105-TFBGA,CSPBGA
48-TSOP
100-VBGA
114-LFBGA
130-VFBGA
132-TBGA
153-LFBGA
169-LFBGA
272-LFBGA
153-TFBGA
153-VFBGA
153-WFBGA
169-VFBGA
169-WFBGA
90-VFBGA
86-TFSOP(0.400,10.16mm wide)
60-VFBGA
66-TSSOP (0,400,10,16mm)