Total: 23
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
bulk
128Gb(16G x 8)
0°C ~ 70°C(TA)
48-TFSOP(0.724,18.40mm wide)
52-VLGA
100-TBGA
mould
100-VBGA