Total: 85
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
pallet
1Gb(128M x 8)
-40°C ~ 85°C
-40°C ~ 85°C(TA)
-40°C ~ 95°C(TC)
-40°C ~ 105°C(TA)
0°C ~ 70°C(TA)
0°C ~ 95°C(TC)
60-TFBGA
63-TFBGA
24-TBGA
48-TFSOP(0.724,18.40mm wide)
63-VFBGA
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
48-TFSOP(0.173,4.40mm wide)
48-VFBGA
78-VFBGA
8-VLGA Exposed Pad
67-VFBGA
67-VFBGA(6.5x8)