Total: 58
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
pallet
1Gb(128M x 8)
-40°C ~ 85°C(TA)
63-TFBGA
24-TBGA
48-TFSOP(0.724,18.40mm wide)
63-VFBGA
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
48-VFBGA
8-VLGA Exposed Pad
67-VFBGA
67-VFBGA(6.5x8)