Total: 39
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
pallet
1Gb(128M x 8)
2Gb(256M x 8)
4Gb(512M x 8)
8Gb(1G x 8)
32Gb(4G x 8)
16Gb(2G x 8)
-40°C ~ 85°C(TA)
48-TFSOP(0.724,18.40mm wide)
63-VFBGA
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
67-VFBGA
67-VFBGA(6.5x8)
63-BGA(9x11)