Total: 56
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
pallet
256Mb(16M x 16)
256Mb(32M x 8)
512Mb(32M x 16)
512Mb(64M x 8)
1Gb(64M x 16)
1Gb(128M x 8)
2Gb(128M x 16)
4Gb(512M x 8)
32Mb(4M x 8,2M x 16)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(16M x 8,8M x 16)
512Mb(64M x 8,32M x 16)
128Mb(4M x 32)
1Gb(32M x 32)
128Mb(FLASH-NOR),1Gb(FLASH-NAND)(16M x 8(FLASH-NOR),128M x 8(FLASH-NAND))
1Gb(NAND),512Mb(LPDDR2)
1Gb(NAND),1Gb(LPDDR2)
-40°C ~ 85°C
-40°C ~ 85°C(TA)
-40°C ~ 95°C(TC)
-40°C ~ 105°C(TC)
0°C ~ 85°C(TC)
0°C ~ 70°C(TA)
0°C ~ 95°C(TC)
-40°C ~ 85°C(TC)
-25°C ~ 85°C(TC)
60-TFBGA
84-TFBGA
24-TBGA
48-TFSOP(0.724,18.40mm wide)
63-VFBGA
121-WFBGA
8-WDFN Exposed Pad
56-TFSOP(0.724,18.40mm wide)
64-LBGA
96-TFBGA
48-VFBGA
134-VFBGA
FBGA
96-VFBGA
8-WLGA Exposed Pad
90-TFBGA
54-TFBGA
78-VFBGA
66-TSSOP (szerokość 0,400,10,16mm)