Total: 6
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
TR,CT
1Gb(128M x 8)
2Gb(256M x 8)
8Gb(1G x 8)
1Gb(1G x 1)
-40°C ~ 105°C(TA)
24-TBGA
48-TFSOP(0.724,18.40mm wide)
63-VFBGA
16-SOIC(0.295,7.50mm wide)