Total: 13
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
pipe
1Gb(128M x 8)
2Gb(2G x 1)
32Gb(4G x 8)
64Gb(8G x 8)
256Gb(32G x 8)
1Gb(1G x 1)
128Gb(16G x 8)
-40°C ~ 85°C(TA)
48-TFSOP(0.724,18.40mm wide)
52-VLGA
100-TBGA
16-SOIC(0.295,7.50mm wide)
100-VBGA