Total: 15
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
TR
4Gb(4G x 1)
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 105°C(TC)
8-UDFN
24-TBGA
63-VFBGA
16-SOIC(0.295,7.50mm wide)