Total: 3
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
TR
32Mb(4M x 8)
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
8-SOIC(0.209,5.30mm wide)
8-DIP(0.300,7.62mm)