Total: 2
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
TR
256Kb(32K x 8)
-40°C ~ 105°C(TA)
8-SOIC(0.154,3.90mm wide)
8-TSSOP(0.173,4.40mm wide)