Total: 3
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
pallet
TR
256Mb(32M x 8)
-40°C ~ 85°C(TA)
-40°C ~ 95°C(TC)
60-TFBGA
16-SOIC(0.295,7.50mm wide)
8-WLGA Exposed Pad