Total: 5
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
bulk
pallet
TR
TR,CT
2Gb(2G x 1)
-40°C ~ 105°C(TC)
24-TBGA
mould
16-SOIC(0.295,7.50mm wide)