Total: 4
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
TR
4Mb(512K x 8)
-40°C ~ 105°C(TA)
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad