Total: 38
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
TR
64Gb(8G x 8)
0°C ~ 70°C(TA)
48-TFSOP(0.724,18.40mm wide)
52-VLGA
100-TBGA
132-VBGA
152-VBGA
mould
100-VBGA