Total: 103
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk
256Mb(32M x 8)
256Mb(64M x 4)
512Mb(32M x 16)
512Mb(64M x 8)
512Mb(128M x 4)
1Gb(64M x 16)
1Gb(128M x 8)
1Gb(256M x 4)
2Gb(256M x 8)
4Mb(512K x 8,256K x 16)
8Mb(1M x 8)
16Mb(2M x 8)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(32M x 4)
1Gb(128M x 8,64M x 16)
32Mb(8M x 4)
64Mb(16M x 4)
2.7V ~ 3.6V
1.7V ~ 2V
1.7V ~ 3.6V
3V ~ 3.6V
4.5V ~ 5.5V
-40°C ~ 105°C
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 105°C(TC)
0°C ~ 70°C(TA)
-40°C ~ 125°C(TA)
-40°C ~ 125°C
200 MHz
75 MHz
108 MHz
133 MHz
60ns
70ns
80ns
90ns
8ms,2.8ms
8ms,5ms
55ns
24-TBGA
48-TFSOP(0.724,18.40mm wide)
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
40-TFSOP(0.724,18.40mm wide)
44-SOIC(0.496,12.60mm wide)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
64-TBGA
24-LBGA
64-TFBGA