Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk
2Mb(256K x 8)
1.65V ~ 1.95V
-40°C ~ 105°C(TA)
80 MHz
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad