Total: 17
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk
256Mb(32M x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
8Mb(1M x 8,512K x 16)
16Mb(2M x 8,1M x 16)
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
80 MHz
104 MHz
24-TBGA
mould
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad