Total: 9
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk
256Mb(64M x 4)
128Mb(32M x 4)
32Mb(8M x 4)
64Mb(16M x 4)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 125°C(TA)
108 MHz
8ms,5ms
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad