Total: 24
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
4Gb(512M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
SPI - Four I/O
ONFI
-40°C ~ 85°C
-40°C ~ 85°C(TA)
104 MHz
22 ns
20ns
25ns
48-TFSOP(0.724 ,18.40mm wide)
250µs
24-TBGA
63-VFBGA
8-WDFN Exposed Pad