Total: 63
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
64Mb(8M x 8)
2.7V ~ 3.6V
1.7V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
108 MHz
133 MHz
80 MHz
104 MHz
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UDFN Exposed Pad
8-WFDFN Exposed Pad
8-SOIC
8-WLGA