Total: 1
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
2Gb(256M x 8)
2.7V ~ 3.6V
SPI - Four I/O
-40°C ~ 85°C(TA)
104 MHz
16-SOIC(0.295,7.50mm wide)