Total: 21
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
128Mb(8M x 16)
1.7V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 85°C(TC)
-30°C ~ 85°C(TA)
40 MHz
52 MHz
66 MHz
85ns
56-TFSOP(0.724,18.40mm wide)
64-TBGA
56-VFBGA
80-LBGA
88-TFBGA,CSPBGA