Total: 14
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
1Gb(128M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
64Mb(16M x 4)
64Mb(8M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
SPI - Four I/O,QPI
1.65V ~ 2V
2.65V ~ 3.6V
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
120 MHz
75 MHz
133 MHz
104 MHz
3ms
24-TBGA
8-SOIC(0.154,3.90mm wide)
8-WDFN Exposed Pad