Total: 1281
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(16M x 16)
256Mb(32M x 8)
512Mb(32M x 16)
512Mb(64M x 8)
1Gb(64M x 16)
1Gb(128M x 8)
2Gb(128M x 16)
4Mb(512K x 8)
8Mb(1M x 8)
8Mb(1M x 8,512K x 16)
16Mb(2M x 8)
16Mb(2M x 8,1M x 16)
32Mb(2M x 16)
32Mb(4M x 8)
32Mb(4M x 8,2M x 16)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(16M x 8,8M x 16)
128Mb(8M x 16)
256Mb(32M x 8,16M x 16)
512Mb(64M x 8,32M x 16)
16Mb(512K x 32)
32Mb(1M x 32)
64Mb(8M x 8)
64Mb(8M x 8,4M x 16)
2Gb(256M x 8,128M x 16)
512Mb Flash Memory,64Mb RAM
256Mb Flash Memory,256Mb DDR DRAM
256Mb Flash Memory,64Mb RAM
-
1.7V ~ 1.95V
2.7V ~ 3.6V
1.7V ~ 2V
3V ~ 3.6V
1.65V ~ 3.6V
1.65V ~ 1.95V
1.65V ~ 2.75V
-40°C ~ 85°C
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-25°C ~ 85°C(TA)
-25°C ~ 85°C
0°C ~ 70°C(TA)
-40°C ~ 125°C(TA)
-55°C ~ 125°C(TA)
0°C ~ 85°C(TA)
-40°C ~ 145°C(TA)
200 MHz
83 MHz
100 MHz
166 MHz
40 MHz
75 MHz
108 MHz
133 MHz
66 MHz
80 MHz
104 MHz
56 MHz
85 MHz
76 MHz
84-TFBGA
24-TBGA
48-TFSOP(0.724,18.40mm wide)
mould
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
8-UDFN Exposed Pad
44-VFBGA
48-VFBGA
56-VFBGA
80-BQFP
80-LBGA
133-VFBGA
48-TSOP
80-VFBGA
84-VFBGA
8-WFDFN Exposed Pad
8-SOIC
16-SOIC
24-VBGA
8-WSON(6x8)
64-FBGA(9x9)
8-WSON(5x6)
80-PQFP(14x20)
48-FBGA(8.15x6.15)
64-FBGA(13x11)
56-TSOP
Contact pad
8-WLGA
56-SOP(0.524,13.30mm wide)
64-VFBGA