Total: 76
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(16M x 16)
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(128M x 8)
2Gb(256M x 8)
64Mb(4M x 16)
128Mb(16M x 8)
16Mb(1M x 16)
64Mb(8M x 8)
128Mb(4M x 32)
512Mb Flash Memory,64Mb RAM
1.7V ~ 1.95V
2.7V ~ 3.6V
1.7V ~ 2V
2.3V ~ 3.6V
3V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI,DTR
SPI - Four I/O,DTR
1.65V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
0°C ~ 70°C(TA)
-40°C ~ 125°C(TA)
166 MHz
1.8ms
8ms,2.8ms
60-TFBGA
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
54-TSOP(0.400,10.16mm wide)
90-TFBGA
54-TFBGA
50-TSOP(0.400,10.16mm wide)
24-VBGA