Total: 178
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(32M x 8)
256Mb(64M x 4)
512Mb(64M x 8)
512Mb(128M x 4)
1Gb(256M x 4)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(32M x 4)
128Mb(8M x 16)
32Mb(8M x 4)
64Mb(16M x 4)
64Mb(8M x 8)
256Mb Flash Memory,256Mb DDR DRAM
1.7V ~ 1.95V
2.7V ~ 3.6V
1.7V ~ 2V
SPI - Four I/O
1.65V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-25°C ~ 85°C(TA)
-40°C ~ 125°C(TA)
108 MHz
8ms,5ms
45ns
8-UDFN
24-TBGA
100-LBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UDFN Exposed Pad
24-LBGA
44-VFBGA
56-TFBGA,CSPBGA
133-VFBGA
84-VFBGA
8-WFDFN Exposed Pad